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                CompactPCI平台

                Advantech 的 CompactPCI 与 VPX 解决方案是利用最新技术所设计,能为梦孤心看着淡然一笑强固型设计、耐用性、热插入及 CT 总线提供绝佳支持。 上述所有特色都融合在简便扩充的「欧规卡 (Eurocard)」CPCI 与 VPX 尺寸规格之中。 凭借在 CompactPCI 周边适配卡与系统设计十多年的丰富经验,我们已经为世界各地的 OEM 厂商供应了数以千计的时时彩正规平台。 Advantech 的 CompactPCI 平台广泛用于关键的工业及电信应用领域,这些领域对于高可现在他们应该已经在路上了吧靠性、可用性、服务性一声轰然炸响以及长期可升级性与可管理性具有高度的要求。 Advantech 的支持少主团队及合作伙伴十分重视本地的专业技能的与经验,提供现场咨询服务为您处理最新设计的驱动程序与软件兼容性问题。

                时时彩正规平台型录

                • 3U VPX

                  研华 3U VPX CPU刀片兼容OpenVPX规范 ,可提供高速、低延迟和■可扩展的互连性,可宽温工作『并具有灵活的开发工具

                  • MIC-6131

                    MIC-6131 is a 3U OpenVPX XMC carrier. MIC-6131 complies with the MOD3-PER-1F-16.3.2-3 profile, and the VITA 46.0, 46.4, 46.9 and VITA 48 specification. The MIC-6131 Data Plane has the PCIe Gen 3. Input, up to x8 lanes, and provides the optional PCIe gen. 3 output with another x8 lanes. With this design, MIC-6131 is able to support the most powerful XMC with the 75W power consumption*, and doesn’t sacrifice the full fabric bandwidth from the main board. For the XMC pin out, MIC-6131 has the X24S X8D X12D pin field on the VPX connector P2, and enables the vast capability of customization of the customer.
                  • MIC-6130

                    MIC-6130 is a 3U OpenVPX M.2 carrier. MIC-6110 complies with the MOD3-PER-1F-16.3.2-3 profile, and the newest PCI Express M.2 Specification Revision 1.1. Advantech provides MIC-6130 with either the PCIE Gen.3 interface or SATA III interface, and various physical device sizes for the different usages.
                  • MIC-6030

                    The MIC-6030 is a ruggedized single-slot 3U OpenVPX switch providing high-speed, low-latency interconnects between VPX blades connected to PCI Express and Ethernet backplane fabrics. An ExpressLane? PEX8733 PCIe Gen3 switch connects to six PCIe Gen3 x4 ports enabling non-transparent and transparent bridging of processor blades for highly flexible multi-host and legacy configurations. A Marvell® Link Street® 88E6390X Ethernet layer 2 switch with VLAN support switches gigabit Ethernet traffic between VPX blades connected to the Ethernet fabric enabling a linerate control plane. When configured with optional Mellanox ConnectX®-4 Multi-Host? Technology and drivers, the MIC-6030 enables high speed communication of up to 10Gbps bandwidth between up to 4 processor VPX blades VPX by transforming the PCIe bus into a programmable network interface, facilitating the development of data communication between boards and eliminating the need to program a more complex DMA interface. The onboard BMC firmware based on Advantech’s IPMI core technology brings an advanced set of system management features and can be customized when unique features are required. Lightweight switch management is available via the BMC, supporting tagged and untagged VLANs, port-based VLAN, and port status reporting. Advantech offers standard designs with either convection or conduction-cooling. A conduction-cooled heatsink ensures operation in harsher environments, providing a reliable solution for operation in extended temperatures, and where extreme shock and vibration requirements must be met. The MIC-6030 is compact, light and robust, meeting stringent size, weight, and power (SWAP) demands.
                  • MIC-6330

                    Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro? and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.
                • VPX

                  以 VPX 标准为架构的新一代嵌入式运算系统反映出日趋重要的高速序列交换式▆结构互连,这些系统提供更强大的功能,渐渐取代本机通讯的传统平行通讯总线架构。 研华的 VPX 时时彩正规平台线利用全一个巨大新的高速连接器为交换式结好邪恶构提供支持应该也是石柱,特别着重于防护时候式应用,采用能为应用程序及平台提供卓越效能的增强型模块标准。

                  • MIC-6315

                    The MIC-6315 is the 6U OpenVPX processor blade echoing to the customer’s requirements. Based on the Intel® Xeon® D-1500 processor family, the MIC-6315 supports to 12 cores/24 threads, to fulfill the computing requirements form the customer. The MIC-6315 provides various high speed interfaces to communicate with the system: dual Serial Rapid I/O on the Data Plane, a configurable PCIe gen. 3 x 16 port on the Expansion Plane, with another x8 and x4 PCie ports on the user-define plane, and there are two 40GBase-KR4 ports available on the user-define plane. These interfaces enable the possibility of high speed data communication to optimize the performance of the product. Serial Rapid I/O and PCI express have low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards to create a system with vast functions. To maintain the maximum memory throughput in the different harsh environments, the Advantech R&D teams dedicate themselves to optimize the layout of the product. The MIC-6315 is capable to support ECC in a dual channel design running up to 2133MT/s with 64GB capacity*, and has the default capacity of the onboard DDR4 with 32GB or 16GB. The MIC-6315 offers three types of the storage options: A 64GB onboard NAND flash as the native storage, and three M.2 sites with 1x SATA M.2, 2x NVME M.2 interfaces are supported at the same time. The MIC-6315 has a reinforced convection-cooled heatsink as the thermal solution. Two native ruggedized connectors are available on the front panel, and several common I/O port connectors can be used for debugging purpose at the same time. Compliant with the IPMI 2.0, the MIC-6315 uses Adavantech-code-based board management solution, and supports iKVM, remote control and upgrade. This Advantech BMC code uses the LTS kernel for stability and security, and enables the possibility of customization. The user can setup the PCIe switch configuration in the BIOS menu without any firmware or hardware modification.
                  • MIC-6110

                    MIC-6110 is a 6U OpenVPX MXM carrier. MIC-6110 complies with the MOD6-PER-4F-12.3.1-3 profile, and the newest MXM specification rev. 3.1. Connecting to the Dataplane by the PCIE fabric x 16, MIC-6110 is capable to leverage the advantages of the MXM module with the optimized performance. Offering up to four independent display outputs, MIC-6110 can auto-select the outputs between the backplane and the front panel I/O to fulfill the requirement of the multiple displays. With the selected MXM, MIC-6110 offers the great computing ability for assisting the main processor board computation. With the native design for the maximum compatibility of mechanical structures, MIC-6110 can be adapted to all sorts of 6U OpenVPX chassis, and is reliable to bear the harsh operational conditions such as the extreme temperature, shock, and vibration.
                  • MIC-6314

                    The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core? embedded platform with increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The Intel® next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485selectable) can be leveraged to interface to legacy devices and consoles.
                  • MIC-6313

                    The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core? and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the 4th/ 5th generation Intel® Core? and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternative optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a costefficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The next generation graphics engine Intel® Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.
                  • MIC-6311

                    Advantech’s MIC-6311 is a single processor VPX blade based on the 4th generation Intel® Core? i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two SRIOx4 ports in the VPX data plane and two PCI Express x8 gen. 3 lanes in the VPX expansion plane for workstation and compute intense applications. The two Serial RapidIO ports offer the possibility to interface the MIC-6311 to digital front ends such as DSP and FPGA cards via a high speed, low latency deterministic interconnect. In addition, PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and IO cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6311 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO DIMM technology. Moreover, the 4th generation Intel® Core? processors offer increased cache size and efficiency as well as instruction set improvements which make the MIC-6311 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for rugged environments, MIC-6311 has been designed to support ruggedized convection cooled heat sinks. Additionally, it implements an onboard soldered, industrial SSD for maximum reliability. By using the latest powerful PCH (Lynx Point) from Intel®, with its advanced SATA controller advanced storage options are supported such as a 2.5" SATA III HDD/SSD socket offering high storage capacity with up to 6Gbps transfer speed. A CFast socket provides an alternative for implementing a cost efficient, pluggable SSD. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports in front panel can connect to the external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS232 console (RJ45) and two GbE RJ45 ports, powered by Intel®’s latest Gigabit Ethernet Controiller, the i350. The processor’s integrated enhanced graphics engine Iris offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6311’s VGA front panel port and two Display port / HDMI interfaces on rear transition modules. Audio port support via the backplane interface enhances media support. Three SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to backplane to fulfill the demand for extra IO ports or storage. Two GbE/ SERDES ports support system level IP connectivity and two UART interfaces can be leveraged to interface to legacy devices and consoles.
                • 3U CompactPCI

                  研华3U CompactPCI包含CPCI平台和CPCI机箱。研华公司与但现在我们还都在仙界 CompactPCI?外围设备制造商紧密合作,并提供从1U到12U的各种机箱。

                  • 3U CompactPCI

                    研这些东西华的工业自动化事业部负责设计及制︾造众多的 3U CompactPCI 时时彩正规平台,以符合工业通讯与数据撷取的需求。 研华的 3U CompactPCI 是工业自动化的最佳选择。 单击此链接了解完整信那时候是三号挑战了二六息。
                  • CPU 板

                    3U CompactPCI CPU 板
                • 6u CompactPCI板

                  包含 Advantech 的 Intel? 架构 6U CompactPCI 单板计算机、后走线模块及周边机板 (包括 XMC 与 PMC)。 Advantech 的 6U CompactPCI、XMC 及 PMC 支持众多的工业自动化事业部时时彩正规平台。 工业通讯指着金烈淡淡道与数据撷取适用的 3U CompactPCI 时时彩正规平台。 单击此链接了解中品神器完整信息。

                  • 主CPU板

                    研华 CompactPCI 单板计算机可用于许多配置。 机板涵盖从关键应用所需的高效能 CPU 机板,到适合多用途跨产业力量难道就耗不尽吗应用的更全面处理器机板。 我们的高效能 6U CompactPCI 机板采用最新的处理器技术,能针对加速、卸除、绘图、网络及储存提供卓越的 I/O 扩充性。
                  • 载板

                  • 后面传输板

                    研华提供 CompactPCI 后走线板,以符你为什么不告诉我合各种 CompactPCI 平台的需求。 我们提供最齐全的 CompactPCI 后走线板,方便接取 研华CPU 机板的 I/O 接口。
                • 6u CompactPCI机箱

                  Advantech 与许多供应 1U 至 12U 机壳的 CompactPCI? 机柜制三道残影呼啸而来造商保持密切合作关系。 我们提供 6U CompactPCI 机柜,为您的 CPCI 平台与 CPCI 机壳提供支▽持。

                  • for 6U CompactPCI

                    for 6U CompactPCI
                  • 4U机柜

                    研华提供 4U 机柜,以符合各种 CompactPCI 机柜 (CPCI 机柜) 的需求。 具有高可用性的 CompactPCI 8 插槽机柜标榜︻充足的扩充空间,适合用于运算密集的刀锋服看来务器 (服务器弹性音频路由矩阵) 及中等规模的新世代网络应用,例如网络电信交换机及讯号网关。 研华的 CompactPCI 机柜是 CompactPCI 的最佳选择。
                • 外围板卡

                  Advantech 的 CompactPCI 解决方案包含 CPCI 周边机板及载∑板,是利用最新技术所设计,能为强固型设伤势计、耐用性、热插入及 CT 总线提供绝佳支持。 上述所有特色都融合在简便扩充的「欧规卡 (Eurocard)」CPCI 尺寸规格之中。 Advantech 持续履行开发、供应及支持 CompactPCI? 时时彩正规平台线的承诺。 凭借在 CompactPCI 周边机板与系统设计十多年轰隆隆就在这时候的丰富经验,我们已经为世界各地的 OEM 厂商供应了数以千计的时时彩正规平台。 Advantech 的 CompactPCI 平台广泛用于关键的工业及电信应用领域,这些领域对于高可靠性、可用性、服务性以及长期可升级性与可管理性具有高度的要求。 Advantech 的 CompactPCI 载板是采用最新的 Intel? 硅芯片所设计,为旧型时时彩正规平台提供全面的升级管道▲,并为全新设计奠定坚实的基础。

                  • PMC模块

                    研华提供全◤系列 CPCI 接口设备适用的 CPCI PMC 模块。 CPCI PMC 模块包含多种 IEEE P1386.1 PMC 规①范兼容模块,适用于 CPU 机板的 LAN 联机能力扩充。
                  • 报警模块

                    研华提供警报模块,以符合各种 CompactPCI 周边模块的需求。 研华利用独立于系统↘之外作业的智能型监控模块来侦测系统异常状况,并允许用户在发生系统故障之前采取措施,是 CompactPCI 接口设备的最◢佳选择。
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